SparkFun SEN-08606 Flex Sensor
SEN-08606 is a CMOS Sensor
Unlike CCD sensors, CMOS sensors have multiple transistors at each photosite. This allows for image processing to be done on-chip, which saves power and improves image quality. They also read off electrical charges at a much faster rate, which is important for high-speed sequences.
Both CMOS and SPAD sensors use p-type and n-type semiconductors, but they operate differently. When a single photon strikes the sensor, it generates a tiny amount of charge. The CMOS sensor then needs to accumulate this charge over time to detect the photon. SPAD sensors, however, use a phenomenon known as Avalanche Multiplication to multiply the electrons generated by the single photon. This results in a large current that can be detected immediately.
This flex sensor is 4.5″ long and increases its resistance when the metal pads are bent to the outside (text on inside of bend). Leads have a popular 2.54 mm (0.1″) pitch, so this sensor can easily be connected with wires.
SEN-08606 is a CMOS Temperature Sensor
CMOS Temperature Sensors have been used in a variety of applications, including environmental monitoring and overheating protection. These sensors must have a high degree of accuracy and low power consumption. To achieve these goals, they must be constructed using cost-effective standard CMOS processes and have minimal complexity. They also need to be robust over temperature and process variations.
This paper introduces a new temperature sensor that provides an accurate and low-power solution to these challenges. The design uses a threshold voltage-based circuit to convert temperature information into a digital signal. This digital signal is then compared to the reference voltage to generate a pulse. The design is implemented in a 0.18 mm 1P6M CMOS process. Its active die area is 0.026 mm2.
The chip’s performance compares well to previous work, achieving a maximum error of
SEN-08606 is a CMOS Pressure Sensor
MEMS pressure sensors convert physical parameters into an electrical output. These devices have been used in a wide variety of applications from medical to space exploration. They have advantages over traditional bulky machined sensors, such as their small size and low power consumption.
CMOS-MEMS sensor technology allows for the integration of signal processing circuits and provides high sensitivity with lower noise levels. However, this technology is still evolving. Its sensitivity is affected by temperature, and the sensor requires a separate on-chip amplifier to compensate for this effect.
This paper presents the design and characterization of a resonant CMOS-MEMS pressure sensor in standard 180 nm CMOS BEOL layers. Three prototypes were designed, and their structural aspects were analyzed. The devices were characterized under different pressures, and their Q-factor was measured experimentally. The device consists of aluminum square plates connected together by tungsten vias integrated in the BEOL layer. All the devices were able to operate in slip, transition and free-molecular regimes.
SEN-08606 is a CMOS Light Sensor
The SparkFun SEN-08606 is a flex sensor which converts the amount of bend in the sensor into an electrical resistance value. The more the sensor is bent, the higher the resistance value. The flex sensor has leads with a popular 2.54 mm (0.1″) pitch, which makes it easy to connect to other components. The flex sensor is connected to a GreenPAK IC and a TowerPro servo motor. SnapMagic Search offers free symbols & footprints for this component in Eagle, Altium, Cadence OrCad & Allegro, and KiCad.